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 Home > Business > Capability
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| Tester |
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Tester
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Specification |
| iFlex |
200MHz, 75V, Mixed Signal Option |
| Uflex |
400Mbps, Mixed Signal Option, RF Option |
| T2000ISS |
Various MIPI Option, 64 Parallel, CIS Option |
| J750 |
200MHz, Mixed Signal Option |
| IP750EX |
200MHz, CIS Option |
| Magnum ICP |
100MHz, CIS Test option |
| Verigy93K |
800Mbps, Mixed Signal Option |
| Magnum SV |
100MHz, Mixed Signal Option |
| ST7200 |
200MHz, Mixed Signal Option |
| Magnum 1 ssv |
200MHz, 512ch, Mixed Signal Option |
| Aemulus |
Upto 64 RF Port, 6GHz Frequency Range |
| ETS364 |
66MHz, APU-12, SPU-100 |
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| 기타 (Prober, Hander, AVI) |
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기타 장비
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Specification |
| PROBER |
8" ~ 12" Option, Hot & Cold Option |
| HANDLER |
Small PKG~ High Pin PKG : PDIP, PLCC, SOP, TSOP,
QFP, LQFP, TQFP, GFN, BGA, CSP, TSV 등 Test |
| AVI |
8" ~ 12" Wafer AVI, 1.8㎛
Particle Inspection |
| Auto Bake |
300mm Wafer Furnace system |
| UV Eraser |
U300mm Wafer, Auto Erase System |
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| DP 장비 |
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| Equipment |
Specification |
| Coater_DAVID-C300 |
Wafer Size : 8", 12" / Wafer coating thickness : ≤3um |
| Lamination_DT-ECS1030SA |
Wafer Size : 6", 8" / Cutter Heating : Up to 150℃ |
| Lamination_CUWLA-120 |
Wafer Size : 8", 12" / Cutter Heating : Up to 120℃ |
| Back Grind_DGP8760/61 |
Wafer Size : 8", 12" / Dry Polishing Option |
| Back Grind_DFG8540 |
Wafer Size : 4", 6", 8" |
| Back Grind_CMG802XJ |
Wafer Size : 8", 12" / Polishing Option |
| UV_CUUVA-120 |
Wafer Size : 8", 12" / Illuminance : 80~120mw/cm2 |
| Laser Mark_CSM3300FC |
Wafer Size : 8", 12" / Wafer Length : Green 532nm |
| Plasma_JSPCS-700M |
Chamber Type / Gas control : Ar, O2, Ar+H2 2 Channel |
| Laser Groove_DFL-7161 |
Wafer Size : 8", 12" / Laser Type : FX Type |
| US Saw_CSX501 |
Wafer Size : 8" / Ultrasonic Spindle / Spindle RPM : 1,000~12,000 |
| Dicing_DFD6361/62 |
Wafer Size : 8", 12" / Spindle RPM : 6,000～60,000/min, 20,000～80,000/min |
| Dicing_AD3000T |
Wafer Size : 8", 12" / Spindle RPM : 1,000～60,000/min |
| Die Sorter_APP-L10 |
Input Wafer : 8", 12" / Output : Tray 2”, 3”, 4” / Accuracy : Gap ±40㎛ |
| Die Sorter_CDT-300 |
Input Wafer : 8", 12" / Output : 8", 12" / Accuracy : Gap ±50㎛, Rotation ≤ 1º |
| Die Sorter_DS9000 |
Input Wafer : 8", 12" / Output : 8"/ Accuracy : Gap ±50㎛, Rotation ≤ 1º |
| Remover_DAVID-R300 |
Wafer Size : 8" / Process : Coating Chemical Remove → D.I Water Cleaning |
| AVI_Eagle-i, Eagle-Ti |
Wafer Size : 6", 8", 12" / Pixel resolution : 3㎛, 1.7㎛, 1.1㎛, 0.85㎛ |
| AVI_HT-1200 |
Tray Size : 2”, 3”, 4” / Pixel resolution : 3.3㎛ |
| Inking_ESA-068) |
Ink Size : Small Dot : 200~500 ㎛, Large Dot : 500~1000 ㎛ |
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| 분석 장비 |
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| Analysis Equipment |
Specification |
| FE-SEM/EDS |
Resolution : 0.7 nm at 15kV, 1.0 nm at 1kV / Magnification : ×25 ~ ×1,500,000 |
| 3D Depth Profiler |
Resolution : 0.01 nm / Non-contact 3D Method / Maximun Magnification : x28800 |
| Contact Angle |
Measurement Range : 0~180° |
| Warpage Measurement |
Camera : Standard 2.0 Mega Pixel (1628 x 1236), Digital, Black & White |
| Chip Strength |
Speed Accuracy : +/-0.1%, Max Speed at Full Load mm/min : 2500 |
| Drop Test |
Payload Capacity : 85kg, Maximum Height : 150 cm |
| Vibration Test |
Motor Frequency : 10 ~ 60Hz / Amplitude Direction : Up & Down (0~3mm) |
| Ball Shear Test |
Bonded Wire Integrity Test, 6"/150mm, 8"/200mm |
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